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HDI 5G Optical Module PCB High Frequency Circuit Board RO4350B TU768

Detail Information

Place of Origin:

Shenzhen, China

Certification:

ISO/TS16949/RoHS/TS16949

Application:

5G Signal Test Board

Characteristic:

High Frequency+FR4 Material

Material:

RO4350B+TU768

Layer:

Thickness:

1.6±0.16mm

Min Hole Diameterv:

Mechanical Hole 0.20mm. Aspect Ratio:8:1

Min Width/space:

100/100um

Surface Finish:

ENIG(0.05um)

Internal Model:

X04B002C04

Packaging Details:

Air bead vacuum packaging

Supply Ability:

200,000 square meters/year

Highlight:

Product Description

HDI with 1+N+1 High frequency

Project	PCB process capability
Layer count	1-40 Layers
Min outer line width/space	3/3mil
Outer copper thickness	280um(8OZ)
Inner copper thickness	210um(6OZ)
Tolerance of PCB thickness	board thickness≤1.0mm; ±0.1mm,+/-0.05mm below 4 layers board thickness＞1.0mm; ±10%
Minimum PTH	Mechanical hole 4mil, laser 3mil
Material	FR-4 ,High Tg ,Halogen-free ,PTFE ,Rogers,Polyimide
HDI	Levels 2-7
Special Process	Buried blind vias, blind slots, rigid-flex combination,mixed pressure, back drilling, buried resistance,buriedcapacitance, milling steps, multi-combination impedance;