Immersion Silver High Layer PCB Multi Layer Circuit Board OSP Surface

Product Description:

The High Layer PCB, also known as Upper-tier printed circuitry or High-floor circuit board, is a superior printed wiring board designed for advanced circuit design.

The High Layer PCB boasts a high layer count, making it ideal for complex and high-performance electronic devices. With its advanced circuit design, this PCB is capable of handling high-speed signals and providing reliable performance.

One of the key features of the High Layer PCB is its impedance control. This ensures that the electrical characteristics of the circuit are maintained, minimizing signal interference and ensuring optimal performance.

The High Layer PCB is also RoHS compliant, meeting environmental and safety regulations. This makes it a sustainable and safe choice for electronic devices.

When it comes to line width and spacing, the High Layer PCB sets the bar high with a minimum of 3mil for both. This allows for more precise and compact circuitry, perfect for miniaturized electronic devices.

The solder mask color options for the High Layer PCB include green, blue, black, red, yellow, and white. This not only adds aesthetic appeal but also helps with identification and organization of different circuits.

In summary, the High Layer PCB is a top-of-the-line product that offers high layer count, impedance control, RoHS compliance, and precise line width and spacing. Its advanced circuit design makes it a superior choice for demanding electronic applications, making it a go-to option for engineers and designers.

Features:

• Product Name: High layer PCB
• Min. Solder Mask Clearance: 0.1mm
• Surface Finish:
  • HASL
  • ENIG
  • OSP
  • Immersion Silver
  • Immersion Tin
• Lead Time: 3-5 Days
• Silkscreen Color:
  • White
  • Black
  • Yellow
• Material: FR-4

Key Features:

• Advanced layer PCB design
• Superior printed wiring board
• High-grade PCB material
• Thin solder mask clearance for precise circuitry
• Various surface finish options for specific needs
• Short lead time for efficient production
• Customizable silkscreen color for branding purposes
• Durable FR-4 material for reliable performance

Technical Parameters:

Applications:

High Layer PCB, also known as Advanced layer PCB, is a sophisticated laminate board designed to cater to the high-performance electronic devices. With its elite layer circuit board and high-density interconnect technology, this product has become a popular choice among industries that require the highest level of precision and reliability.

High Layer PCB is widely used in various industries, especially those that demand high-speed signal transmission and complex circuitry. Some of the most common application scenarios include:

• Communications Industry: High Layer PCBs are widely used in the communications industry for high-speed data transmission in devices such as routers, switches, and hubs.
• Automotive Industry: With the increasing use of electronic components in modern vehicles, High Layer PCBs are used in advanced driver assistance systems, infotainment systems, and other electronic control units.
• Aerospace Industry: High Layer PCBs are essential in the aerospace industry, where high-performance electronic devices are required for navigation, communication, and control systems in aircraft and spacecraft.
• Medical Industry: In the medical industry, High Layer PCBs are used in medical equipment such as MRI machines, pacemakers, and defibrillators, where precision and reliability are of utmost importance.

High Layer PCB is known for its exceptional quality and advanced technology. Some of its key features include:

• High Layer Count: As the name suggests, High Layer PCBs have a high layer count, ranging from 8 to 24 layers. This allows for complex circuitry and high-density interconnects, making them suitable for advanced electronic devices.
• Copper Thickness: High Layer PCBs offer a wide range of copper thickness options, from 1/3 Oz to 2 Oz, to cater to different design requirements.
• Silkscreen Color: The silkscreen color options for High Layer PCBs include white, black, and yellow, providing flexibility in design and making it easier to identify different components on the board.
• Min. Solder Mask Clearance: High Layer PCBs have a minimum solder mask clearance of 0.1mm, ensuring precise and accurate soldering, even for small components.
• Impedance Control: The use of impedance control technology in High Layer PCBs ensures stable and reliable signal transmission, making them suitable for high-speed data transmission.

High Layer PCBs play a crucial role in the functioning of high-performance electronic devices in various industries. With its advanced technology and exceptional features, this product has become a go-to choice for industries that require precision, reliability, and high-speed signal transmission. When it comes to high-density interconnects and complex circuitry, High Layer PCBs are the top choice for engineers and designers worldwide.

Customization:

Our High Layer PCB is the perfect solution for your complex and high-performance electronic designs. With our advanced manufacturing capabilities and customizability options, we can provide you with a sophisticated laminate board that meets your specific needs.

• HASL (Hot Air Solder Leveling)
• ENIG (Electroless Nickel Immersion Gold)
• OSP (Organic Solderability Preservative)
• Immersion Silver
• Immersion Tin

Our High Layer PCBs can accommodate small and precise components with a minimum hole size of 0.2mm. This allows for greater design flexibility and increased functionality for your electronic devices.

• White
• Black
• Yellow

Our High Layer PCBs are specifically designed for high-density and complex circuit designs, with layer counts ranging from 6 to 40 layers. This allows for more efficient use of space and improved signal integrity.

We use advanced production techniques and equipment to achieve a minimum line width and spacing of 3mil/3mil. This ensures precise and accurate routing of your circuit design, resulting in a superior printed wiring board.

With our High Layer PCB customization service, you can expect high-quality and reliable circuit boards for your most demanding applications. Contact us today to learn more about how we can meet your specific requirements.

Packing and Shipping:

High layer PCB is a delicate electronic product that requires special packaging and shipping to ensure its safe arrival to the customer. Here are the steps we take to package and ship our high layer PCBs:

• First, all components of the high layer PCB are carefully inspected and tested to ensure they are in good working condition.
• Next, the PCB is placed in an anti-static bag to prevent any damage from static electricity.
• Then, the PCB is placed in a foam-lined box to provide cushioning and protection during transit.
• If the PCB has any fragile components, they are individually wrapped in bubble wrap and placed in the box.
• The box is then sealed with tape and labeled with the product name and shipping information.

We take great care in shipping our high layer PCBs to ensure they arrive safely and on time. Here is our shipping process:

• Once the product is packaged, it is handed over to our trusted shipping partner.
• Our shipping partner uses secure and reliable transportation methods to deliver the product to the customer's address.
• We provide a tracking number to the customer so they can monitor the status of their shipment.
• Upon arrival, the customer's signature is required to confirm the delivery and ensure that the product is received in good condition.

With our careful packaging and reliable shipping methods, customers can trust that their high layer PCBs will arrive in perfect condition.

FAQ:

• Increased design flexibility: High layer PCBs allow for more complex and compact designs due to the higher number of layers.
• Improved signal integrity: With more layers, there is less crosstalk and interference between signals, resulting in better overall performance.
• Higher density: High layer PCBs can accommodate more components in a smaller area, making them ideal for miniaturized devices.
• Better thermal management: The additional layers provide more space for heat dissipation, ensuring better temperature control and reliability.
• Reduced noise: The multiple layers act as shields, reducing the noise level and improving the quality of the signal.

• Signal integrity: The design should ensure minimal interference between signals to maintain high-quality communication.
• Thermal management: Adequate spacing and proper placement of components should be considered to dissipate heat effectively.
• Power distribution: The power distribution network should be carefully designed to provide stable and sufficient power to all components.
• Crosstalk: Measures should be taken to minimize crosstalk between signals, such as using ground planes and signal routing techniques.
• Manufacturability: The design should be optimized for efficient production to reduce costs and ensure high-quality output.