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High Layer PCB
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Impedance Control Layer PCB Board With 0.15mm Silkscreen Clearance

Impedance Control Layer PCB Board With 0.15mm Silkscreen Clearance

Detail Information
Lead Time:
3-5 Days
Min. Line Width/Spacing:
3mil/3mil
Min. Silkscreen Clearance:
0.15mm
Silkscreen Color:
White, Black, Yellow
Material:
FR-4
Min. Solder Mask Clearance:
0.1mm
Surface Finish:
HASL, ENIG, OSP, Immersion Silver, Immersion Tin
Impedance Control:
Yes
Highlight:

0.15mm Silkscreen Clearance PCB Board

,

Impedance Control Layer PCB Board

Product Description

Product Description:

Our High Layer Printed Circuit Board is made with the highest quality materials and the latest technology to ensure superior performance and durability. With a layer count that can go up to 32 layers, you can be confident that our High Layer PCB can accommodate even the most complex designs.

Our High Layer PCB comes with a minimum solder mask clearance of 0.1mm, ensuring that your design is accurate and precise. With copper thickness ranging from 1/3 Oz to 2 Oz, you can be sure that our High Layer PCB can handle high current and power applications with ease.

We also offer a minimum silkscreen clearance of 0.15mm, ensuring that your design is clearly labeled and easy to read. Our High Layer PCB also comes with a variety of surface finishes, including HASL, ENIG, OSP, Immersion Silver, and Immersion Tin, giving you the flexibility to choose the surface finish that best suits your project needs.

Our High Layer PCB is ideal for a wide range of applications, including aerospace, telecommunications, medical devices, and more. With our High Layer PCB, you can expect a reliable and efficient performance that can handle even the most demanding designs.


Features:

  • Product Name: High Layer PCB
  • Board Thickness: 0.2mm To 6.0mm
  • Min. Silkscreen Clearance: 0.15mm
  • Copper Thickness: 1/3 Oz To 2 Oz
  • Min. Line Width/Spacing: 3mil/3mil
  • Silkscreen Color: White, Black, Yellow
  • High Density Interconnect Board
  • High Layer Multi-level PCB
  • High Layer Multilayer PCB

Technical Parameters:

Product Attribute Technical Parameter
Product Name High Layer Circuit Board / High Density Interconnect PCB / High Layer Multi-level PCB
Board Thickness 0.2mm To 6.0mm
Copper Thickness 1/3 Oz To 2 Oz
Lead Time 3-5 Days
Min. Line Width/Spacing 3mil/3mil
Min. Silkscreen Clearance 0.15mm
Min. Hole Size 0.2mm
Solder Mask Color Green, Blue, Black, Red, Yellow, White
Silkscreen Color White, Black, Yellow
Rohs Compliant Yes
Min. Solder Mask Clearance 0.1mm

Applications:

One of the key features of this product is its impedance control, which ensures that the electrical signals are transmitted at a consistent rate, regardless of the length of the trace or the number of connections. This makes it ideal for applications where high speed and high frequency signals are required, such as in telecommunications, aerospace, and medical equipment.

The High Layer PCB Board is designed to provide high performance and reliability in a compact form factor. It has a minimum solder mask clearance of 0.1mm, which allows for precise placement of components and reduces the risk of short circuits. The product also has a minimum silkscreen clearance of 0.15mm, which ensures that the text and symbols on the board are legible and easy to read.

The High Layer Printed Wiring Board is available in a range of solder mask colors, including green, blue, black, red, yellow, and white. This allows for customization of the board to match the specific requirements of the application.

Some of the common applications for the High Layer PCB Board include power supplies, signal processing, control systems, and data storage. It is also used in consumer electronics, such as smartphones, tablets, and wearables, as well as in industrial automation and automotive systems.

Overall, the High Layer PCB Board is a versatile and reliable product that can be used in a wide range of applications. Its high density interconnect design, impedance control, and precision manufacturing make it an ideal choice for applications that require high performance and reliability in a compact form factor.


Customization:

Our Product Customization Services for High Layer PCB include:

  • Design of High Density Interconnect PCBs
  • Customization of High Layer Multilayer Boards
  • Creation of Multi Layer PCBs
  • Min. Silkscreen Clearance: 0.15mm
  • Min. Solder Mask Clearance: 0.1mm
  • Min. Line Width/Spacing: 3mil/3mil
  • Layer Count: High Layer
  • Board Thickness: 0.2mm To 6.0mm

Support and Services:

The High Layer PCB product technical support and services include:

  • Expert consultation on product selection and design
  • Assistance with PCB layout and component placement
  • Advice on manufacturing and assembly processes
  • Testing and quality assurance services
  • Repair and maintenance support
  • 24/7 customer support for technical assistance

Packing and Shipping:

Product Packaging:

  • The High Layer PCB product will be packaged in a sturdy cardboard box.
  • The box will be securely sealed with adhesive tape to prevent any damage during transit.
  • The product will be wrapped in bubble wrap to provide extra protection against any bumps or knocks during shipping.
  • A packing slip with the customer's order details will be included inside the box.

Shipping:

  • The High Layer PCB product will be shipped via a reputable courier service.
  • The customer will be provided with a tracking number to track the delivery status of their order.
  • Shipping costs will be calculated based on the customer's location and the weight of the product.
  • Delivery times may vary depending on the customer's location and the courier service used.

FAQ:

A High Layer PCB, or High Density Interconnect (HDI) PCB, is a printed circuit board with a high number of layers and a high density of components. These boards are designed to support complex electronic circuits and are commonly used in applications where space is limited.

2. What are the benefits of using a High Layer PCB?

High Layer PCBs offer several advantages over traditional PCBs, including:

  • Higher component density, allowing for more functionality in a smaller footprint
  • Improved signal integrity and reduced noise
  • Enhanced reliability due to shorter signal paths and fewer interconnects
  • Greater design flexibility, enabling more complex circuitry
3. What are the design considerations for High Layer PCBs?

Designing a High Layer PCB requires careful consideration of several factors, including:

  • Layer count and stackup configuration
  • Placement and routing of components
  • Signal integrity and power distribution
  • Thermal management
  • Manufacturing constraints and capabilities
4. What industries typically use High Layer PCBs?

High Layer PCBs are used in a variety of industries, including:

  • Telecommunications
  • Automotive
  • Medical
  • Aerospace
  • Consumer electronics
5. What is the manufacturing process for High Layer PCBs?

The manufacturing process for High Layer PCBs typically involves several steps, including:

  • Design and layout
  • Drilling and plating of vias
  • Lamination and bonding of layers
  • Etching and plating of circuitry
  • Assembly and testing